TI AM335X Development Board (IAC-335X-Kit)

Core Module is designed by 6-floor PCB; the volume is only card size; together with CPU, DDR2 RAM, NandFlash, DataFLash, network; using 5V dc power supply, low power consumption; 2 x 100 BtoB connectors lead various commonly used interfaces; The core module is compatible with all AM335x-ARM Cortex-A8 series processors, and the users can choose different types of appropriate processor chip to reduce cost(only for bulk users).

Note: the AM3354 is the standard processor of IAC-335-X-Kit, which is to reduce the users' costs, and the rest of the models are compatible spell foot, only for bulk users!

Core Module（IAC-335X-CM）Specifications:

CPU Processor

• TI AM335X, ARM Cortex-A8 core
• 720MHz

DDR RAM Memory

• 256MB DDR2 RAM, 133MHz, 16bit data bus(The batch can be extended to maximum 512MB)

FLASH Storage

• On-board 2MB Dataflash 
• On-board 256M*8bits NandFlash could change a large capacity or industrial chip according to customer's requirement(The batch can be extended to maximum 64G)

Interfaces

• 2*100 B to B connectors

Other Onboard Resources

• AR8035 net chip, support 10M/100M/1000M Ethernet with RGMII mode
• Power management, single 5V input and output voltage of all core module

PCB Specification & Size

• Using six floors of PCB high precision process, and has the best electrical properties and anti-jamming performance
• 74 x 53 x 1.5mm

Working Parameters

• Working temperature: -20°C~ 70°C (batch user could customize -40°C~ 85°C)
• Humidity Range: 5%~ 95%, Non-Condensing

Low Power Consumption

• 5V Dc power supply, low power consumption, <2W

Support OS

• Linux3.2.0 + QT4
• Android 4.0.3